Related styles and accuracy specifications can be adjusted to meet customer needs. Please contact the business unit for details.
COF Bonding
On the supplied Panel, the Mark recognition image technology is used to attach the COF automation equipment to the correct position․ Corresponding to UHD, QUHD and other high-pixel products with rich experience
․ Equipment composition of customized unique products (large expansion)
․ Optional logistics method (air floating/platform), different equipment length
․ The best equipment for mass production
PCB Bonding
After the COF has been attached to the Panel, the PCB will be attached to the COF automation equipment through Mark recognition․ Equipment composition of customized unique products (large expansion)
․ Corresponding to UHD, QUHD and other high-pixel products with rich experience
․ No JIG replacement for 4 PCB, 8 PCB products
SIDE COF Bonding
The supplied Panel uses Mark recognition image technology to attach COF automation equipment to the correct side position․ The earliest Side Bonding mass production equipment
․ Equipment composition of customized unique products (large expansion)
․ Corresponding to UHD, QUHD and other high-pixel products with rich experience
SIED PCB Bonding
Vertically supply the Panel with COF attached to it, and recognize the PCB by attaching it to the COF automation equipment through Mark recognition․ COF can be attached vertically
․ Equipment composition of customized unique products (large expansion)
․ Corresponding to UHD, QUHD and other high-product products with rich experience
․ No JIG replacement for 4 PCB, 8 PCB products
FLEXIBLE OLED Bonding
COF is attached to the supplied Panel, FPC is attached to the COF, and the flexible bonding Inline system equipment of the Resin reinforcement project is used again․ Core technology for flexible materials (Panel Damage 0%)
․ The company with the most experience in mass production / product development (the world's first successful mass production equipment)
․ Equipment composition of customized unique products (large expansion)
COG Bonding
Automated equipment with IC CHIP attached to the supplied Panel by Marking․ Corresponding to high-pixel smart phone products (1~8”)
․ Preload Tact time 1.8s
․ Compact
․ Equipment composition of customized unique products (large expansion)
MICRO LED FOG Bonding
Bonding (FOG) equipment with COF and FPCB attached to the Rigid Panel through ACF․ Binding COF and FPCB behind the TFT substrate
․ Equipment composition of customized unique products (large expansion)
․ Use TABLET for wireless operation.