Thermal Process Solutions

Related styles and accuracy specifications can be adjusted to meet customer needs. Please contact the business unit for details.

CF：HPCP

Heat treatment after coating equipment of TFT/CF process. Hot Plate & Cool Plate System applied, it has convenient maintenance by fume control and simple piping. A world-class product approved by the Korean government.

Cell : PI PRE BAKE

This is the hot air type Oven System for the hardening process of substrate under 250℃. It has excellent uniformity and stability.

Cell : Hot Air Oven System

This is the Hot Plate System for PI Pre cure. It has excellent fume control and temperature uniformity, and is easy to maintain by simple piping. The PIN Moving system is applied for preventing Mura occurrence.